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BGA
Rework Station and
Accessories
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BGA
REWORK STATION MODEL : 936 A
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Microprocessor
programable controller with
FDD data storage.
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Smart.....
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Adopt
microprocessor NEW
FUZZY control
system.
Have 99 sets of
program memory
mode and
interrigent
parameter setting
mode.
Three sets of
thremocouple can
measure the
heating
characteristic of
body of BGA and PC
Board directly .
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Different
color alignment system makes
perfect image |
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Accurate.....
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Difference color alignment
system: When the images of
BGA and PC Board overlap,
the contrast between two
images will be very clear.
Alignment soldering
mechanism: The alignment of
BGA and soldering are
proceeded at the same
location. The shift caused
by moving, can be avoided
entirely. |
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Supper
size with 3 zones preheating |
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High
Performance and
Efficiency.....
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Rapid
disassembly and
soldering. |
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Extra
large infrared
radiator Preheating:
The area is
360*260m/m and can
be divided into 3
Zones. |
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Quick
cooling device:
Drastically reduce
cooling time by 50%. |
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Z
spindle and
Alignment system can
move automatically. |
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Auto
Pick up can work
with the Profile
controlled by
microprocessor. |
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Work
with electricity and
compressed air is
not necessary.
Module design. Low
cost for maintenance
and repair. Satisfy
the regulations of
CE and MIL. |
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Designed
for Lead-Free
Solders. Completely
comply with the
requirements of
Lead-Free process. |
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BGA
Rework Station Model 935BL
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Easy
Operation and high
performance is what
BGA-935BL famous for
Equipped with outstanding
nozzles and precise
temperature device,
BGA-955BL is popular in
RMA departments and Mobil
Phone field.
3 minutes setup work in
microprocessor controller,
BGA-935BL will precisely
and accurately proceed BGA
soldering and desoldering
work.
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Nozzle
Size ( Common Size,
Special Size ) Unit mm
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BGA / CSP
/ LLP
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SOP.QFP
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NO.
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SIZE
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TYPE
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NO.
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SIZE
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TYPE
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OH
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CH
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OH
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CH
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BGA-N001
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5X5
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BGA-N041
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13X12
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BGA-N004
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5X10
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BGA-N043
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13X20
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BGA-N007
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10X10
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BGA-N045
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15X22
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BGA-N008
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10X12
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BGA-N047
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17X30
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BGA-N010
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10X15
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BGA-N051
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11X11
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BGA-N013
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20X20
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BGA-N052
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13X13
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BGA-N016
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16X24
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BGA-N053
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15X15
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BGA-N020
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29X29
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BGA-N054
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17X17
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BGA-N022
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32X32
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BGA-N055
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19X19
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BGA-N024
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37X37
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BGA-N056
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21X21
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BGA-N025
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39X39
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BGA-N057
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23X23
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BGA-N026
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42X42
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BGA-N058
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25X25
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BGA-N028
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45X45
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BGA-N059
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26X20
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BGA-N029
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55X45
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BGA-N061
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33X33
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BGA-N030
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70X70
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BGA-N062
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35X35
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BGA-N031
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62X57
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BGA-N032
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60X20
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SOJ.PLCC
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DIP-PGA
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NO.
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SIZE
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TYPE
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NO.
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SIZE
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TYPE
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OH
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CH
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OH
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CH
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BGA-N081
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10X17
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BGA-N121
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10X20
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BGA-N083
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12X19
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BGA-N122
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10X22.5
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BGA-N085
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12X27
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BGA-N123
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10X25
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BGA-N090
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12X12
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BGA-N124
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10X27.5
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BGA-N091
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14X14
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BGA-N131
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18X32
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BGA-N093
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17X15
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BGA-N133
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18X37
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BGA-N095
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20X20
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BGA-N135
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18X42
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BGA-N096
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25X25
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BGA-N139
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18X52
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BGA-N097
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27X27
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BGA-N141
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21.5X21.5
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BGA-N098
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32X32
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BGA-N143
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29X29
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BGA-N099
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37X37
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BGA-N145
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34X34
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BGA-N147
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49X49
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Replacement
Fixtures
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Replacement
Fixture
World No.1 fast and
convenient solution for
BGA Chip Replacement work.
Can replace various types
of BGA, uBGA, CSP and LLP.
High precision aluminum
alloy structure, durable,
light and efficient.
Fast and Convenient to
reflow solder balls on the
BGA chips, one cycle only
at 30~90 seconds.
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BGA
Paste Flux
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BGA
Paste Flux
Rosin
materials designed for ball
grid array process (BGA)
requiring reflow
application.
Can be successfully reflowed
in infrared convention or
vapor phase systems.
Can be safely left on the PC
board after reflow without
cleaning. |
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BGA
Solder Ball
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BGA
Solder Ball
High
precision circular size. The
tolerance of diameter within
0.02mm.
Solder balls are packed in
argon gas for delivery to
user.
A wide range of solder balls
size and type for option,
such as 0.2, 0.3, 0.45, 0.5,
0.6, and 0.76 mm .......etc. |
